For the first time ever, the innovative plasmadust® coating module makes it possible to metallize and coat nearly all types of material – temperature-sensitive synthetics, metals, silicon wafers, glass, foil or paper – extremely efficiently on a solvent-free basis. This opens up completely new application areas in the field of electrical connection/contacting as well as in the production of functional layers. The basic plasmadust® tool consists of a powder processing unit, as well as the plasma media supply and can be equipped with an array of up to six coating heads. The kinematics of the generators can be automated flexibly, depending on the application.
The facts
- Possible base substrates: synthetics, paper, cardboard, textiles, glass, metal, ceramics
- Suitable powder sizes: 0.1µm to 20µm
- Producible thickness of layers: 1-200 μm
- Various different powder materials can be processed: metallic powder, semiconductor, compound semiconductor, polymers
- Agglomerate-free powder feed of microparticles
- Feed rate: 0.5 - 10 g/min
- Typical coating speeds (feeder): 1 - 50m/min
- Typical coating rate (deposition rate): 10 μm @ 10 m/min
- Applicable plasma gases: air, nitrogen, forming gas
Applications
- Manufacture of functional layers {heat-conductive, decorative}
- EMC shielding
- Flexible p.c. boards
- Printed electronics
- Functional layers
- Conductive textiles
- Tribological layers
- Thin-film batteries
- Membranes for fuel cells
- Change in rigidity of basic materials