Whether temperature-sensitive plastics, metals, silicium disks, glass, foil or paper - for the first time - Reinhausen Plasma GmbH's patented plasmadustlll technology permits almost any material to be metallized and coated without solvents and with extreme energy efficiency. This opens up completely new applications in the areas of electrical connection/contacting and the generation of function coats.
The Facts:
- Coating powders: copper, aluminum, tin, bismuth tellurite, CIGS, polymers (PTFE, PE, ABS, PP)
- Usable powder sizes:
100 nm - 20 μm - Feed rate: 0.5 - 50 g/min
- Agglomerate-free, powder feeding of nano and micro-particles
- Possible base substrates: Paper, cardboard, textiles, glass, metal, ceramics, polymers
- Layer thicknesses that can be generated: 1 - 100 11m
- Typical coating speeds (feed): 1 - 50 m/min
- Typical coating rates (depositing speed): 10 11m @ 10 m/min
- Usable plasma gases: Air, nitrogen, argon, various additives (e.g., hydrogen, oxygen)
Applications:
- Processing of nano particles
- Plasma sintering
- Laser sintering
- Metallization of solar cells
- Wafer coating
- EMC shielding
- Manufacturing of flexible PCBs
- Printed Electronics
- Thin-film batteries
- Membranes for fuel cells
- Abrasion-resistant coatings
- Manufacturing of Sputter Targets
- Manufacturing of function layers {heatconductive, decorative, tribo/ogical}
- Change in rigidity of basic materials