Whether temperature-sensitive plastics, metals, silicium disks, glass, foil or paper - for the first time - Reinhausen Plasma GmbH's patented plasmadust® technology permits almost any material to be metallized and coated without solvents and with extreme energy efficiency. This opens up completely new applications in the areas of electrical connection/contacting and the generation of function coats.
The Facts:
- Coating powders: copper, aluminum, tin, bismuth tellurite, CIGS, polymers (PTFE, PE, ABS, PP)
- Usable powder sizes:
100 nm - 20 μm - Feed rate: 0.5 - 50 g/min
- Agglomerate-free, powder feeding of nano and micro-particles
- Possible base substrates: Paper, cardboard, textiles, glass, metal, ceramics, polymers
- Layer thicknesses that can be generated: 1 - 100 11m
- Typical coating speeds (feed): 1 - 50 m/min
- Typical coating rates (depositing speed): 10 11m @ 10 m/min
- Usable plasma gases: Air, nitrogen, argon, various additives (e.g., hydrogen, oxygen)
Applications:
- Processing of nano particles
- Plasma sintering
- Laser sintering
- Metallization of solar cells
- Wafer coating
- EMC shielding
- Manufacturing of flexible PCBs
- Printed Electronics
- Thin-film batteries
- Membranes for fuel cells
- Abrasion-resistant coatings
- Manufacturing of Sputter Targets
- Manufacturing of function layers {heatconductive, decorative, tribo/ogical}
- Change in rigidity of basic materials